This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Development of Light-Weight Multifunctional Structures
Technical Paper
2007-01-3130
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Language:
English
Abstract
Today, in several industrial fields, the integration of functions is a key technology to enhance the efficiency of components in terms of performance to mass/volume/cost/ratio.
Concerning the space industry, in the last few years the trend in spacecraft design has been towards smaller, light-weight and higher performance satellites with sophisticated payloads and instrumentation. Increasing power density figures are the common feature of such systems, constituting a challenging task for the Thermal Control System. The traditional mechanical and thermal design concepts are evidencing their limits with reference to such an emerging scenario.
A promising solution consists in designing structural elements of a spacecraft that can integrate multiple functions: the capability of realizing a high level of integration of the different subsystems (typically structural strength, thermal control, electronics and shielding) into a multifunctional structure seems to represent an enabling technology in order to respond to the growing demands of present and future space missions.
A research program on the development of lightweight high-performance Multifunctional Structures (MFS) has been financed by the European Community under the MULFUN - Multifunctional Structures project. MULFUN is a STRP of the Sixth Framework Programme, carried out by an international team, coordinated by the Spanish Inasmet. Within the consortium, Thales Alenia Space Italia (TAS-I) is mainly in charge of thermal control aspects and thermo-mechanical design.
The MFS concept is based on an efficient use of advanced composite materials and components, on disruptive solutions for integrated design, dedicated modeling and simulation tools so as advanced assembly/manufacturing approaches.
Based on a deep investigation of the involved concepts and technological needs, the aim of the MULFUN project is the design, the manufacturing and testing of four MFS demonstration breadboards. The first two breadboards are devoted to the integration of thermal control and electrical functions into a unique high-performance structure. Results from this activity are reported in the paper, with emphasis on thermal aspects.
Recommended Content
Journal Article | Methodology for Solving Contact Problem during Riveting Process |
Aerospace Standard | Life Cycle Cost - Techniques and Applications |
Technical Paper | Development of an Electrostatic Suspension Reaction Sphere |
Authors
Topic
Citation
Gottero, M., Poidomani, G., Tavera, S., Sacchi, E. et al., "Development of Light-Weight Multifunctional Structures," SAE Technical Paper 2007-01-3130, 2007, https://doi.org/10.4271/2007-01-3130.Also In
References
- Rawal S. P. Barnett D. M. “Multifunctional Structures Technology Demostration on NMP DS1” Deep Space 1 Technology Validation Report
- Joshi P.B. Silverman E. Shinn E.T. Long E.R. et al “Light-weight structural materials with integral radiation shielding, thermal control and electronics” 44th Intern. SAMPE Symp. Long Beach 1999
- Abusafieh A. Tremblay G. “Lightweight Electronics Enclosures Using Composites” SAMPE Journal 38 6 November December 2002
- Obal M. Sater J. “Multi-functional Structures: The Future of Spacecraft Design?” 5th International Conference on Adaptive Structures Sendai, Japan December 5 7 1994
- Mitra A.K. Jones K.W. “Distributed thermal management systems for the integrated electronic and thermal design of avionics”
- Baturkin V. “Micro-satellites thermal control - concepts and components” Acta Astronautica 56 January 2005
- Welch C. Tsinas A. “Efficient Satellite Structural Design Optimised for Volume Production” 15th AIAA/USU Conference on Small Satellites 2001
- Zaghdoudi M.Chaker Tantolin C. Godet C. “Use Of Heat Pipe Cooling Systems In The Electronics Industry” Electronics Cooling Online
- CRS Eng. Ltd.