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Silicone Thermal Interface Materials For Automotive Electronics
ISSN: 0148-7191, e-ISSN: 2688-3627
Published November 28, 2007 by SAE International in United States
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Today one of the key issues facing electronic systems designs is heat dissipation. This is even more critical in Automotive Electronics because smaller and lighter modules coupled with higher component density lead to increased necessity of thermal power dissipation. Electronic modules with greater functionality and power also generate more heat. Higher temperatures can directly affect the performance and reliability of these modules. The unique properties of silicone thermal interface materials - in the form of adhesives, gels, encapsulants, gap fillers and thermal pads - can help automotive engineers get increased heat dissipation with higher levels of flexibility and better physical and electrical performance.
CitationNascimento, L., Debastiani, E., and Stephan, M., "Silicone Thermal Interface Materials For Automotive Electronics," SAE Technical Paper 2007-01-2962, 2007, https://doi.org/10.4271/2007-01-2962.
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