This content is not included in your SAE MOBILUS subscription, or you are not logged in.
Extending Reliability in Encapsulated Fine Wire Arrays
ISSN: 0148-7191, e-ISSN: 2688-3627
Published November 28, 2007 by SAE International in United States
Annotation ability available
Consumer and automotive electronics increasingly contain high functionality components with arrays of fine pitch thin wire interconnections. Protecting these wire arrays from environmental conditions can be a challenge for both design and materials. One method involves encapsulating the wire loops to maintain electrical isolation from debris and wire movement induced by vibration and thermal or mechanical shock. Encapsulants can range from hard and rigid epoxies to soft and flexible silicones. If the part experiences very large thermal swings, CTE mismatches between the encapsulating material and system components can over-stress wires and especially wirebonds to cause breakage. A study was undertaken to evaluate several encapsulants, showing a strong correlation between thermal shock induced wirebond breakage and encapsulant hardness, with the softest silicone gel providing far superior protection.
|Technical Paper||Pitch Comfort Optimisation of a Front End Loader using a Hydropneumatic Suspension|
|Technical Paper||Investigating Impulsive Sounds - Beyond “Zwicker-Loudness”|
|Technical Paper||Rubber Springs|
CitationDebastiani, E., Larson, K., and Nascimento, L., "Extending Reliability in Encapsulated Fine Wire Arrays," SAE Technical Paper 2007-01-2961, 2007, https://doi.org/10.4271/2007-01-2961.
- Kumbhat N. et.al. “Next Generation of Package/Board Materials for Ultra-high Density Wiring and Fine-Pitch Reliable Interconnection Assemblies” Electronic Components and Technology Conference, 2004, Proceedings, 54 th 2 1843 1850
- Kumar R. “New Developments in Parylene Technology for Medical Electronics Advancement” SMTA Medical Electronics Symposium Sept. 2006
- Kirchner K. Nelson D. “Conformal Coat Impact on Area Array Package Solder Joint Reliability” SMTA International Conf. Sept. 2004
- Nawa K. “Reliability Study for CTE Mismatching in Build-up Structure” Components and Technology Conference, 2001, Proceedings, 51 st 1154 1158
- Dent S. Mine K. Ushio Y. Watson M. “Technology Roadmap for Silicone Adhesives in Thin Multi-Chip Packages” SMTA Pan Pacific Symposium Feb. 2003
- Bulcke V. et.al. “Introducing a Silicone Under The Bump Configuration for Stress Relief in a Wafer Level Package” Electronics Packaging Technology, 2003, 5 th Conference 380 384
- Montemayor L. “Electrically Conductive Silicone Adhesive” NEPCON West Dec. 2002
- Berry P. Marin J. “Thermal Interface Material Solutions for Telecommunication Components” SMTA Telecom Hardware Solutions May 2002
- Wong C. Segelken J. Balde J. “Understanding the Use of Silicone Gels for Non-Hermetic Plastic Packaging” Electronic Components Conference, 1989, Proceedings, 39 th 769 776
- Dent S. “Development of Microelectronic Grade Silicone Materials for Chip Scale Packages” SMTA Pan Pacific Symposium Jan. 2000
- Barcley T. Berry P. “Investigation Into the Effect of Gel Hardness on Solder Joints” SAE 2001 World Congress, Doc. No. 2001-01-0689