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Minimizing Cost of Material Variances in Printed Circuit Board Assembly
Technical Paper
2007-01-0781
ISSN: 0148-7191, e-ISSN: 2688-3627
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Language:
English
Abstract
Controlling the Cost of Variance is essential to the manufacturing process of Printed Circuit Board Assembly for low volume high mix production. The material variance is identified as the additional components and resources consumed beyond the minimum required to complete the project. This Quantity Variance occurs at the effects of defects at key steps of the manufacturing process. Such occurrences result in the need to purchase additional components for the completion of the order. These additional components termed Quantity Variance alter the sequence of the manufacturing process affecting quality, timely delivery of the job and directly impacting company profitability.
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Authors
Citation
Gebara, N., Jawad, B., and Szymanski, P., "Minimizing Cost of Material Variances in Printed Circuit Board Assembly," SAE Technical Paper 2007-01-0781, 2007, https://doi.org/10.4271/2007-01-0781.Also In
SAE 2007 Transactions Journal of Passenger Cars: Electronic and Electrical Systems
Number: V116-7; Published: 2008-08-15
Number: V116-7; Published: 2008-08-15
References
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