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Silicone Thermal Interface Materials for Under-Hood Electronics
Technical Paper
2007-01-0544
ISSN: 0148-7191, e-ISSN: 2688-3627
Sector:
Language:
English
Abstract
Heat dissipation is one of the key issues facing automotive engineers, as performance, reliability and longevity of electronic devices have all been shown to be directly affected by temperature. The current thermal challenges are unprecedented, as smaller engine compartments and higher component density raise under-hood temperatures, while electronic devices with greater functionality and power also generate more heat than previous designs. The unique properties of silicone thermal interface materials can help achieve higher levels of physical and electrical performance in automotive electronics -- facilitating heat dissipation in a variety of forms, including adhesives, gels, encapsulants, gap fillers, fabricated pads and phase change materials.
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Authors
Citation
Stephan, M., "Silicone Thermal Interface Materials for Under-Hood Electronics," SAE Technical Paper 2007-01-0544, 2007, https://doi.org/10.4271/2007-01-0544.Also In
References
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