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3D- ESPI: Thermal Expansion Analysis of Electronic Components
Technical Paper
2006-01-0765
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
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Citation
Schubach, H. and Moser, E., "3D- ESPI: Thermal Expansion Analysis of Electronic Components," SAE Technical Paper 2006-01-0765, 2006, https://doi.org/10.4271/2006-01-0765.Also In
References
- Jones, R. Wykes, C. “Holographic and Speckle Interferometry” 3–5 Cambridge University Press, Cambridge New York, New Rochelle, Melbourne, Sidney 1989
- Ettemeyer, A. Non contact and whole field strain analysis with a laseroptical strain sensor VIII International Congress on Experimental Mechanics June, 10–13 1996 Nashville
- Ettemeyer, A. Eberhardsteiner, J. Gingerl, M. Non-contact Measurement of 3-Dimensional Strain Fields with TV-Holography VDI Berichte Nr. 1118 1994
- Yang, L. Wegner, R. Ettemeyer, A. Micro-Star – the new tool for rapid strain analysis Photomec 99 July 25–27 1999 Liege
- Schubach H.R. Thermal Extension Coefficients on Electronic Components Presentation on Dantec Dynamic User Meeting 2005