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Determination of Whole Field Residual Strain Measurement Using 3D-DSPI and Incremental Hole Drilling
Technical Paper
2006-01-0764
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
An experimental setup utilizing 3D-Digital Speckle Pattern Interferometry (DSPI) 1,2 and Incremental hole drilling is being applied for the non-contact, fast and accurate determination of residual strain as a function of depth. From the measured phase maps using the DSPI technique we can determine the surface deformations in a whole field area around a drilled hole and thus relate these released strains to the residual strains existing in the material. Incremental hole drilling3,4 has been coupled with residual stress measurement to provide a means to estimate the residual stresses as a function of depth. Unlike the traditional holography with a manualevaluation5 in this case the system can quantitatively determine the deformation data in x, y and z directions for various depth increments and thus finally provides us with the residual strains as a function of depth. A 3D-DSPI unit coupled with a custom designed drilling system has been used in an experimental setup to study the residual strain distribution.
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Citation
Samala, P., Wright, F., Yang, L., and Long, K., "Determination of Whole Field Residual Strain Measurement Using 3D-DSPI and Incremental Hole Drilling," SAE Technical Paper 2006-01-0764, 2006, https://doi.org/10.4271/2006-01-0764.Also In
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