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High Thermal Conductive Epoxy Resin Composites with Controlled Higher Order Structures
Technical Paper
2005-01-1673
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
Higher order structures of epoxy resins improved their thermal conductivities. Thermal conductivities were up to 5 times higher than those of conventional epoxy resins, because the molecular groups, mesogens, form highly ordered crystal-like structures which suppress phonon scattering. The crystal-like structures were observed on a microscopic scale using transmission electron microscope (TEM). Mesoscopic structures in the resins were also observed using an atomic force microscope (AFM). The results suggest that control of higher order structure of insulating resins can be used as a novel method to improve their thermal conductivities. Laminates were prepared with the high thermal conductive epoxy resin containing a biphenyl group and ceramic fillers as a part of a feasibility study. Thermal conductivities more than 10 times higher than for ordinary epoxy resin laminates were obtained for test pieces of the laminates.
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Authors
- K. Fukushima - Materials Research Laboratory, Hitachi, Ltd., Japan
- H. Takahashi - Materials Research Laboratory, Hitachi, Ltd., Japan
- Y. Takezawa - Materials Research Laboratory, Hitachi, Ltd., Japan
- M. Hattori - Hikone Factory, Shin-Kobe Electric Machinery Co., Ltd., Japan
- M. Itoh - Hikone Factory, Shin-Kobe Electric Machinery Co., Ltd., Japan
- M. Yonekura - Hikone Factory, Shin-Kobe Electric Machinery Co., Ltd., Japan
Citation
Fukushima, K., Takahashi, H., Takezawa, Y., Hattori, M. et al., "High Thermal Conductive Epoxy Resin Composites with Controlled Higher Order Structures," SAE Technical Paper 2005-01-1673, 2005, https://doi.org/10.4271/2005-01-1673.Also In
Advances in Plastic Components, Processes and Technologies 2005
Number: SP-1960; Published: 2005-04-11
Number: SP-1960; Published: 2005-04-11
References
- Hansen D. D Bernier G. A. “Thermal conductivity of polyethylene: The effects of crystal size, density and orientation on the thermal conductivity,” Polym. Eng. Sci. 12 3 204 208 1972
- Choy C. L. Luk W. H. Chen F. C. “Thermal conductivity of highly oriented polyethylene,” POLYMER 19 155 162 1978
- Choy C. L. Young K. “Thermal conductivity of semicrystalline polymers - a model,” POLYMER 18 769 776 1977
- Choy C. L. Wong S. P. Young K. “Model calculation of the thermal conductivity of polymer crystals,” J. Polym. Sci. Polym. Phys. Ed. 23 1495 1504 1985
- Akatsuka M. Takezawa Y. “Study of high thermal conductive epoxy resins containing controlled high-order structures,” J. Appl. Polym. Sci. 89 2464 2467 2003
- Shiota A. Ober CK. “Synthesis and curing of novel LC twin epoxy monomers for liquid crystal thermosets,” J. Polym. Sci. Part A: Polym. Chem. 34 1291 1303 1996
- Hatta I. Sasuga Y. Kato R. Maezono A. “Thermal diffusivity measurement of thin films by means of an ac calorimetric method,” Rev. Sci. Instrum. 56 8 1643 1647 1985
- Hatta I. Kato R. Maezono A. “Development of ac calorimetric method for thermal diffusivity measurement. II. Sample dimension required for the measurement,” Jpn. J. Appl. Phys. 26 3 475 478 1987
- Dean J. A. Lange's Handbook of Chemistry 15th New York, NY, USA McGraw Hill 1999