This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Mold-In-Color Instrument Panel with Invisible Airbag
Technical Paper
2005-01-0978
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Language:
English
Abstract
One of the emerging designs for hard instrument panel is the integrated system whereby the airbag module is hidden in the IP. With the incorporation of the airbag, improved material requirements are necessary to meet the performance expectation of the IP. A new engineered polyolefin has been developed to provide the required balance in stiffness and low temperature impact properties, as well as excellent surface durability and moldability.
Recommended Content
Citation
Pham, H. and Reid, C., "Mold-In-Color Instrument Panel with Invisible Airbag," SAE Technical Paper 2005-01-0978, 2005, https://doi.org/10.4271/2005-01-0978.Also In
References
- Brignac, S. Young, H. W. Journal of Vinyl & Additives Technology 2 (3) 1996
- Pham, H. Q. Shah S. Munn J. SAE Congress 2002
- Munn, B. Pham, H. Q. Shah, S. SPE TPO Global Conference 2003
- Xiang, C. Sue, H-J. Chu, J. SPE ANTEC Proceedings 1999