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Enhanced Imager Chip Packaging for Automotive Applications
Technical Paper
2005-01-0556
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
The development of an automotive qualified packaging technology for CMOS and CCD imager chips is described. A flip-chip-on-flex solution was developed. This package solution was demonstrated using a 1/3 inch optical format imager chip that was designed for use with conventional ceramic leadless chip carrier packaging. Overall package thickness is 1.39mm, with the complete back-side of the silicon substrate exposed and available for chip cooling. The flex is bonded to a glass substrate, which provides the optical access to the imager chip. The use of a transparent underfill material reduces the rate of moisture infiltration and reduces optical reflections within the package structure. The flex may be extended beyond the package to allow surface mounting of additional passive and active components, as well as interconnection to additional circuitry.
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Authors
- John R. Troxell - Delphi Electronics and Safety
- Jeff H. Burns - Delphi Electronics and Safety
- A. K. Chaudhuri - Delphi Electronics and Safety
- Binghua Pan - Delphi Electronics and Safety
- Chih Kai Nah - Delphi Electronics and Safety
- Kiat Choon Teo - Delphi Electronics and Safety
- David Ihms - Delphi Electronics and Safety
- Stephen Fox - Delphi Electronics and Safety
- Timothy Garner - Delphi Electronics and Safety
- William A. Bauson - Delphi Electronics and Safety
Citation
Troxell, J., Burns, J., Chaudhuri, A., Pan, B. et al., "Enhanced Imager Chip Packaging for Automotive Applications," SAE Technical Paper 2005-01-0556, 2005, https://doi.org/10.4271/2005-01-0556.Also In
Automotive Electronics on CD-ROM from the SAE 2005 World Congress
Number: SP-1980CD; Published: 2005-04-11
Number: SP-1980CD; Published: 2005-04-11
SAE 2005 Transactions Journal of Passenger Cars: Electronic and Electrical Systems
Number: V114-7; Published: 2006-02-01
Number: V114-7; Published: 2006-02-01
Systems Engineering, Electronics Simulation, Advanced Electronics Packaging, and Electromagnetic Compatibility
Number: SP-1926; Published: 2005-04-11
Number: SP-1926; Published: 2005-04-11
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