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Distributed Thermal Management Systems for the Integrated Electronic and Thermal Design of Avionics
Technical Paper
2004-01-2569
ISSN: 0148-7191, e-ISSN: 2688-3627
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Language:
English
Abstract
An architecture for thermal management of avionics and electronics systems based on integrated electronics and thermal design at the PCB board level is introduced. Advantages of this approach include the reduction of the number of external components that are required in relation to existing approaches to advanced liquid-based thermal management techniques along with other gains in efficiency due to the PCB board-level adaptivity that is embedded in this design solution. In addition, this type of system can potentially be implemented as a sealed self-contained solution that will allow maintenance personnel to avoid dealing to hazardous cooling compounds as part of the system maintenance procedures.
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Authors
Citation
Mitra, A. and Jones, K., "Distributed Thermal Management Systems for the Integrated Electronic and Thermal Design of Avionics," SAE Technical Paper 2004-01-2569, 2004, https://doi.org/10.4271/2004-01-2569.Also In
References
- Azar Kaveh “Advanced Cooling Concepts and Their Challenges,” Therminic-2002
- Mudawar Issam “Assessment of High-Heat-Flux Thermal Management Schemes,” IEEE Transactions on Components and Packaging Technologies 24 2 June 2001
- Perret Corinne Boussey Jumana Schaeffer Christian Coyaud Martin “Analytic Modeling, Optimization, and Realization of Cooling Devices in Silicon Technology,” IEEE Transactions on Components and Packaging Technologies 23 4 December 2000
- Yang Ronggui Chen Gang Snyder G. Jeffrey Fleurial Jean-Pierre “Multistage Thermoelectric Micro Coolers,” 2002 Inter Society Conference on Thermal Phenomena 323 329
- Strasser M. Aigner R. Franosch M. Wachutka G. “Miniaturized Thermoelectric Generators Based on Poly-Si and Poly-Ge Surface Micromachining,” Sensor and Actuators A 97-98 2002 535 542