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Packaging for Next Generation Automotive Electronics
Technical Paper
2004-01-1683
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
This paper describes the packaging impacts of forecast advances in automotive electronics in two significant areas:
- The need for a much higher processing performance than is currently found in automotive applications.
- The need for a much higher network performance within a vehicle.
In particular, the thermal and EMC issues resulting from these advances are discussed, and practical, cost effective, automotive relevant, solutions are proposed. To illustrate these issues in a realistic situation, a prototype implementation of a network vehicle controller has been developed.
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Citation
Miller, P. and Nisbet, M., "Packaging for Next Generation Automotive Electronics," SAE Technical Paper 2004-01-1683, 2004, https://doi.org/10.4271/2004-01-1683.Also In
Software/Hardware Systems, Systems Engineering, Advanced Electronics Packaging, and Electromagnetic Compatibility (Emc)
Number: SP-1857; Published: 2004-03-08
Number: SP-1857; Published: 2004-03-08
References
- Isermann, Rolf Schwarz, Ralf Stolzl, Stefan “Fault Tolerant Drive-by-wire Systems” 64 81 IEEE Control Systems Magazine Oct 2002
- Buchanan, James E “Signal and Power Integrity in Digital Systems,” McGraw-Hill 1996
- Johnson, Howard W. Graham Martin “High-Speed Digital Design: A Handbook of Black Magic,” PTR Prentice-Hall 1993
- Sergent, Jerry E. Krum, Al “Thermal Management Handbook for Electronics Assemblies” McGraw-Hill 1998