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Comparing Substrate Solutions for Automotive Power Electronics Applications
Technical Paper
2004-01-1681
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
High power electronic applications in the automotive industry require interconnecting substrates that have high reliability, high thermal conductivity, high current capability, multi-layer potential, and small size. This paper addresses the design requirements for automotive power substrates and how ever increasing demands are challenging the current substrate technology. Four different substrate material types, with various design features, capable of meeting these stringent requirements are described. Thermal impedance testing of each substrate along with design variations to enhance thermal capability was completed. The results of the thermal testing are compared based on appropriate application of the substrate technology.
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Authors
- M. Ray Fairchild - Delphi Delco Electronics Systems
- John D. Myers - Delphi Delco Electronics Systems
- Jerry L. Badgett - Delphi Delco Electronics Systems
- Carl W. Berlin - Delphi Delco Electronics Systems
- D.H.R. Sarma - Delphi Delco Electronics Systems
- Thomas M. Morris - IRC Corporation
- Harold Warren - IRC Corporation
Citation
Fairchild, M., Myers, J., Badgett, J., Berlin, C. et al., "Comparing Substrate Solutions for Automotive Power Electronics Applications," SAE Technical Paper 2004-01-1681, 2004, https://doi.org/10.4271/2004-01-1681.Also In
Software/Hardware Systems, Systems Engineering, Advanced Electronics Packaging, and Electromagnetic Compatibility (Emc)
Number: SP-1857; Published: 2004-03-08
Number: SP-1857; Published: 2004-03-08
References
- The National Electronics Manufacturing Initiative (NEMI) Roadmap December 2000
- Oak Ridge National Laboratory Review 33 3 2000 Power Electronics: Energy Manager for Hybrid Electric Vehicles