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Lead Free Cationic Electro-Deposition for Automobile Body in White
Technical Paper
2003-01-2783
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
Organic tin compounds were examined as replacements for the hardening catalyst function of lead in order to produce a lead-free cationic E-coat. The mechanism of the decline in adhesion, at the interface between the anti-chip primer and the primer surfacer, when an organic tin compound migrated to the anti-chip primer layer, was determined. Monobutyl tin compounds were found to have the lowest mobility within the film of organic tin compounds capable of functioning as hardening catalysts. A lead-free E-coat, employing a monobutyl tin compound, demonstrated no decline in adhesion, and the performance of the film was equivalent to that of conventional E-coat.
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Citation
MORISHITA, H. and KANEKO, K., "Lead Free Cationic Electro-Deposition for Automobile Body in White," SAE Technical Paper 2003-01-2783, 2003, https://doi.org/10.4271/2003-01-2783.Also In
References
- Development of Lead Free Cationic E-coating for Automobile Body in White MORISHITA H. KANEKO K. SAE 2003-01-1338