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Reduction of EMI for ECU with Alumina Multilayer Substrates
Technical Paper
2003-01-0867
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
Several techniques have been studied for reduction of radiation noise from an ECU (electronic control unit) made of alumina multilayer substrates. Some of them were proven to be effective for the RFI (radio frequency interference) reduction through the development of the ECU. The effective methods were separating the analog and digital power planes, increasing the analog ground area, and using common mode chokes. To reduce the electromagnetic radiation, we have also proposed another technique of a multilayer substrate with the power/ground planes of lossy structure, for dispersing the high frequency electromagnetic radiation energy into the multilayer substrate. Power/ground plane structures in the substrate were evaluated using test modules. We have confirmed that the noise level was fairly reduced by these techniques, in the wide range of frequency, comparing with the conventional design.
Authors
- Yoshihiro Takeshita - R&D Center Kagoshima and Kokubu Plant, Kyocera Corporation
- Tadatomo Maehara - R&D Center Kagoshima and Kokubu Plant, Kyocera Corporation
- Hiroshi Matsumoto - R&D Center Kagoshima and Kokubu Plant, Kyocera Corporation
- Masaki Kaji - R&D Center Kagoshima and Kokubu Plant, Kyocera Corporation
- Toyohiko Kano - ECU Development Group, Aisin AW Corporation
- Toshio Nagata - ECU Development Group, Aisin AW Corporation
- Naoto Ogasawara - ECU Development Group, Aisin AW Corporation
Citation
Takeshita, Y., Maehara, T., Matsumoto, H., Kaji, M. et al., "Reduction of EMI for ECU with Alumina Multilayer Substrates," SAE Technical Paper 2003-01-0867, 2003, https://doi.org/10.4271/2003-01-0867.Also In
SAE 2003 Transactions Journal of Passenger Cars - Electronic and Electrical Systems
Number: V112-7; Published: 2004-09-15
Number: V112-7; Published: 2004-09-15
References
- Maehara Tadatomo Sato Shingo Kaji Masaki Matsumoto Hiroshi “Trend of High Density Multilayer Ceramic Substrate and Mount Technology for Automotive ECU,” Denshi-Zairyo 6 60 65 2002
- Miyashita Takuya Wada Osami Koga Ryuji Sano Hiroya “Prediction of Peak Frequencies on Electromagnetic Emission from a Signal Line on a Printed Circuit Board” IEICE. Trans. Commun. E78-B 2 February 1995
- Hubing Todd H. Drewniak James L. Van Doren Thomas P. Hockanson David M. “Power Bus Decoupling on Multilayer Printed Circuit Boards” IEEE Transactions on Electromagnetic Compatibility 37 2 May 1995
- Fukumoto Yukihiro Matsuishi Takuya Toyota Yoshitaka Wada Osami Koga Ryuji “Parameter Identification for a power current model of LSI” Technical Report of IEICE
- Nakamata Katsuro Nishimura Michiaki “Frequency Analysis of IC Package Inductance by the PEEC (Partial Element Equivalent Circuit) Method” The Transaction of the Institute of Electronics, Information and Communication Engineers J75-C-II 6 279 286 1992
- Takeshita Yoshihiro Takenouchi Satoru Terao Shinya Koga Ryuji “Power/Ground Plane Resonance Reduction using High Resistance Conductor Pattern” Technical Report of IEICE July 2000