This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
MEMS Pressure and Acceleration Sensors for Automotive Applications
Technical Paper
2003-01-0204
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Language:
English
Abstract
This paper reviews MEMS product applications in a very demanding automotive environment. Our particular interest is in the MEMS inertial and pressure sensors. Specifics of transducer manufacturing technologies will be explained in details. Also advantages and disadvantages of piezoresistive versus capacitive sensing phenomena will be discussed. Finally, main aspects of the packaging effects on the final device parameters and performance are considered too.
Recommended Content
Technical Paper | New Accelerometer Based on Innovative Packaging and Circuit Design |
Technical Paper | Measurement and Display of the Load Distribution on a Vehicle Seat |
Ground Vehicle Standard | VHDL-AMS Statistical Analysis Packages |
Authors
Topic
Citation
Verma, R., Gogoi, B., and Mladenovic, D., "MEMS Pressure and Acceleration Sensors for Automotive Applications," SAE Technical Paper 2003-01-0204, 2003, https://doi.org/10.4271/2003-01-0204.Also In
SAE 2003 Transactions Journal of Passenger Cars - Electronic and Electrical Systems
Number: V112-7; Published: 2004-09-15
Number: V112-7; Published: 2004-09-15
References
- Fleming W. “Overview of Automotive Sensors” IEEE Sensors Journal 1 4 December 2001 296 308
- Marek J. Tlling M. “Microsystems for the Automotive Industry” IEDM 2000 3 8
- Eddy D. Sparks D. “Application of MEMS Technology in Automotive Sensors and Actuators” Proceedings of the IEEE 86 8 August 1998 1747 1755
- Dudaicevs H. Kandler M. Manoli Y. Mokwa W. Spiegel E. “Surface Micromachined Pressure Sensors with Integrated CMOS Read-Out Electronics,” Sensors and Actuators A 43 1994 157 163
- Scheiter T. Kapels H. Oppermann K.-G. Steger M. Hierold C. Werner W. M. Timme H.-J. “Full Integration of a Pressure-Sensor System into a Standard BiCMOS Process,” Sensors and Actuators A 67 1998 211 214
- Hierold C. “Intelligent CMOS Sensors,” The Thirteenth Annual International Conference on Micro Electro Mechanical Systems (MEMS200) Miyazaki, Japan 23-27 January 2000 1 6
- Trieu H.K. Knier M. Köster O. Kappert H. Schmidt M. Mokwa W. “Monolithic Integrated Surface Micromachined Pressure Sensors with Analog On-Chip Linearization and Temperature Compensation,” The Thirteenth Annual International Conference on Micro Electro Mechanical Systems (MEMS200) Miyazaki, Japan 23-27 January 2000 547 550
- Gogoi B. Neumann K. Hughes D. Jr. Odle D. Monk D. J. August R. McNeil A. Schmiesing J. Foerstner J. “Integrated CMOS Capacitive Pressure Sensor,” October 29 2002
- McNeil A. Monk D.J. Gogoi B. “Method of manufacturing a sensor” 2002
- Ristic L. Gutteridge R. et. al. “Surface Micromachined Polysilicon Accelerometer” Solid-State Sensor and Actuator Workshop” 1992 118 121
- Ristic L. “Trends in MEMS Technology” WESCON 1996 64 72