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End Item Temperature Test -- An Improved LRU-Level Screen
Technical Paper
2002-01-2945
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
This paper details the evaluation and implementation of Honeywell's End Item Temperature Test (EITT) process which functionally tests each production LRU at the customer-required temperature extremes. An aircraft system that formerly utilized 100% screening of electronic parts was selected for this process. A fixture was developed to allow the end item to be thoroughly tested while inside an environmental chamber. Using EITT, Honeywell replaced screening with EITT for specifically selected parts. The EITT adds thermal testing in addition to the normal environmental stress screening and acceptance test procedure steps. EITT also provides an effective tool for root cause failure analysis. The EITT-produced units (LRUs) were found to have 47% fewer IC removals than the previously built systems that were subjected to the 100% part screening. By reducing the part screening-caused damage, a 42% reduction was observed in mechanical damage such as bent leads. Since production implementation in 1998, only 2 field failures have been observed on the more than 300,000 EITT / characterized ICs in the field.
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Citation
Cluff, K. and Scalise, J., "End Item Temperature Test -- An Improved LRU-Level Screen," SAE Technical Paper 2002-01-2945, 2002, https://doi.org/10.4271/2002-01-2945.Also In
References
- Condra, L. Hoad, R. Humphery D. Fink, J. Heebink, J. Wilkinson, C. Marlborough, D. Das, D. Pendsé, N. Pecht, M. Terminology on Use of Electronic Parts Outside the Manufacturer’s Specified Temperature Ranges, IEEE Transactions on Component and Packaging Technology September 355 356 22 3 1999
- EIA (Electronic Industries Alliance) EIA-4900, EIA Standard, Use of Semiconductor Devices Outside Manufacturers’ Specified Temperature Ranges Nov 2001
- IEC/PAS (International Electrotechnical Commission) 62240, Use of Semiconductor Devices Outside Manufacturers’ Specified Temperature Ranges, Tech. Rep 2001-04, 1st 2001
- Humphery D. Condra, L. Pendsé, N. Das, D. Wilkinson, C. Pecht, M. An Avionics Guide to Uprating of Electronic Parts, IEEE Transactions on Components and Packaging Technologies 23 3 595 599 September 2000
- Das, D., Pendse, N., Pecht, M., Wilkinson, C. Parameter re-characterization: a method of thermal uprating, IEEE Transactions on Components and Packaging 24 4 729 737 December 2001
- Wright, M. Humphery, D. McCluskey, C. Uprating Electronic Components for Use Outside Their Temperature Specification Limits, IEEE Transactions on Components, Packaging, and Manufacturing Technology 252 256 A 20 2 1997
- Cluff, K.D. Robbins, D. Edwards, T. Barker, D.B. Characterizing the Commercial Avionics Thermal Environment for Field Reliability Assessment, Journal of the IES July-Aug 1997 22 28
- Claridge, D. Robbins, D. Characterizing Environments in Commercial Airplanes to Improve Avionics Maintenance, ASME International Mechanical Engineering Conference and Esposition, Anaheim, CA, November 18 1998
- Pendse, N. Pechet, M. Parameter Re-characterization Case Study: Electrical Performance Comparison of the Military and Commercial Versions of all Octal Buffer, Future Circuits International 6 63 67 Technology Publishing Ltd, London, UK, 2000
- Hester, K. Koehler, M. Kanciak-Chwialkowski, H. Jones, B. As Assessment of the Value of Added Screening of Electronic Components for Commercial Aerospace Applications, Microelectronics Reliability, 41 1823 1828 2001