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Comparison of Thermal Performance of Different Power Electronic Stack Constructions
Technical Paper
2002-01-1917
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Event:
Future Car Congress
Language:
English
Abstract
IGBT (Insulated Gate Bipolar Transistor) power modules are of great importance in the development of Electrical Vehicles (including Fuel Cell Vehicles) and Hybrid Electrical Vehicles. The effective thermal management of power modules requires the optimized system configuration of both power modules and coldplates/heatsinks. In this paper, three different stack constructions of IGBT power modules are proposed and their thermal performance is studied using 3-D finite element simulations. The thermal resistance and temperature distribution under both isothermal and convectional (liquid cooled) boundary conditions are carefully calculated and compared. The advantage and disadvantage for each of three stack constructions are discussed and presented.
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Authors
- Kanghua Chen - Electric Drives and Power Conversion Div., Ballard Power Systems Corp.
- Sayeed Ahmed - Electric Drives and Power Conversion Div., Ballard Power Systems Corp.
- Doug Maly - Electric Drives and Power Conversion Div., Ballard Power Systems Corp.
- Scott Parkhill - Electric Drives and Power Conversion Div., Ballard Power Systems Corp.
- Fred Flett - Electric Drives and Power Conversion Div., Ballard Power Systems Corp.
Citation
Chen, K., Ahmed, S., Maly, D., Parkhill, S. et al., "Comparison of Thermal Performance of Different Power Electronic Stack Constructions," SAE Technical Paper 2002-01-1917, 2002, https://doi.org/10.4271/2002-01-1917.Also In
SAE 2002 Transactions Journal of Passenger Cars - Electronic and Electrical Systems
Number: V111-7; Published: 2003-09-15
Number: V111-7; Published: 2003-09-15
References
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