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Direct-Soldered Mounting Inverter Modules for Traction Motor Drives †*
Technical Paper
2002-01-1889
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Event:
Future Car Congress
Language:
English
Abstract
Mounting power module by directly soldering them onto the heatsink can significantly reduce the thermal impedance between power module and heatsink as compared to the conventional bolted method that requires thermal grease or other interface materials in between. However, the problem of this mounting technique is the voids existing in the thermal interface. In this paper, void reduction techniques are studied through solder paste selection, heating procedure, and temperature profile. In order to study the effect of void rate, a 15-MHz Scanning Acoustic Microscope (SAM) is used as an inspection tool. To measure the thermal interface impedance, a constant current source injection into power diode along with curve tracer measurement was adopted. Experimental results indicate that the reduction of void rate also significantly reduces the thermal interface.
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Citation
Lai, J., Kim, J., and Konrad, C., "Direct-Soldered Mounting Inverter Modules for Traction Motor Drives†*," SAE Technical Paper 2002-01-1889, 2002, https://doi.org/10.4271/2002-01-1889.Also In
SAE 2002 Transactions Journal of Passenger Cars - Electronic and Electrical Systems
Number: V111-7; Published: 2003-09-15
Number: V111-7; Published: 2003-09-15
References
- Toyota Technical Review 48 2 Mar. 1999 29 30
- William W. So Chin C. Lee “Fluxless Process of Fabricating In-Au Joints On Copper Substrates” IEEE Transactions On Components and Packaging Technologies 23 2 June 2000
- Niklaus Frank Enoksson Peter Kalvesten Edvard Stemme Goran “Void Free Full Wafer Adhesive Bonding,” IEEE 2000
- Onuki Jin Chonan Yasunori “A New Void Free Soldering Process in Large Area, High Power IGBT Module” Proceedings of ISPSO 2000, May 22-25 Toulouse, France
- Haque Shatil Lu Guo-Quan “Thermal Management of Power Electronics Modules Via Acoustic Micrography Imaging,” Conference Record of Applied Power Electronics Conference Feb. 2000 New Orleans, LA