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Thermal Shock Resistance of Advanced Ceramic Catalysts for Close-Coupled Application
Technical Paper
2002-01-0738
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
This paper examines the relative thermal shock requirements for ceramic catalysts in underbody vs. close-coupled positions. The higher operating temperature in the latter position may imply higher coefficient of thermal expansion and higher thermal stresses, depending on substrate/washcoat interaction, than those for underbody position. An analysis of thermal stresses, using relevant physical properties and temperature gradients, is presented for both close-coupled and underbody catalysts. Three different high temperature close-coupled catalysts, employing advanced ceramic substrates with 600/3, 600/4 and 900/2 cell structure, and an underbody catalyst with 400/6.5 standard ceramic substrate are examined. Such an analysis is valuable for designing the optimum aspect ratio (length/diameter) and packaging system, which will minimize thermal and mechanical stresses over the desired lifetime of 120K vehicle miles. The analysis shows that the recommended aspect ratio for close-coupled application may be different from that for underbody application depending on operating conditions and the packaging design.
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Gulati*, S., Hampton, L., and Lambert, D., "Thermal Shock Resistance of Advanced Ceramic Catalysts for Close-Coupled Application," SAE Technical Paper 2002-01-0738, 2002, https://doi.org/10.4271/2002-01-0738.Data Sets - Support Documents
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References
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