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New, High Efficiency, Low Cost Liquid Heat Exchanger for Cooling Power Semiconductor Devices
Technical Paper
2001-01-1743
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
A novel extruded aluminum heat exchanger for cooling power semiconductor devices used in hybrid vehicles is described. The patented and patent pending design employs an enhanced heat transfer surface and turbulence generating devices to efficiently remove heat from devices, such as IGBTs, and reject it into the vehicles coolant loop. Heat transfer rates approach brazed plate-fin designs while the pressure drop remains low at high coolant flow.
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Citation
Wright, C. and Wright, L., "New, High Efficiency, Low Cost Liquid Heat Exchanger for Cooling Power Semiconductor Devices," SAE Technical Paper 2001-01-1743, 2001, https://doi.org/10.4271/2001-01-1743.Also In
References
- “Hybrid Vehicle Saves Fuel, Pollutes Less” Regulatory Intelligence Data Industry Group 91 May 14 1999
- BAE Systems Peterson Bill Mr. Electronic Power Conversion
- Webb, Ralph L. Principles of Enhanced Heat Transfer” John Wiley and Sons, Inc. 1994
- Kays, W.M London, A.L. Compact Heat Exchangers” Krieger Publishing Co. Malabar FL 3rd 1998
- Shah, R.K. “Temperature Effectiveness of Multiple Sandwich Rectangular Plate-Fin surfaces”- Technical Report No. 71 Stanford University July 1969
- K&K Associates “TAKIII Thermal Analysis Kit III” 1997 www.tak2000.com
- Lopina, R.F. Bergles, A.E. “Heat Transfer and Pressure Drop in ‘Tape-Generated Swirl Flow of Single Phase Water” Transactions of the ASME Aug. 1969
- Mills, A.F. “Basic Heat and Mass Transfer 2nd Prentice Hall, Inc. NJ 1999
- Shah, R.K. London, A.L. “Laminar Flow Forced Convection Heat Transfer and Friction in Straight and Curved Ducts-A Summary of Analytical Solutions” Technical Report No. 75 Dept of Mechanical Engineering, Stanford University Nov. 1971
- “Low-Cost Liquid Heat Transfer Plate and Method of Manufacturing Therefor”