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OCP - Materials
Technical Paper
2001-01-1022
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Event:
SAE 2001 World Congress
Language:
English
Abstract
Outokumpu Copper Strip AB has developed Copper alloys for use in heat exchanger applications where high temperature joining is employed. The alloys are basically low alloyed Copper and Brass. These alloys are particularly suitable for the brazing of Copper and Brass heat exchangers. For joining purposes an alloy has been developed as brazing filler material. That alloy has properties that give high strength at comparatively low brazing temperatures. All these alloys are being used in the CuproBraze process of manufacturing copper and brass heat exchangers. This paper will explain the properties of these materials and their use.
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Citation
Falkenö, A. and Ainali, M., "OCP - Materials," SAE Technical Paper 2001-01-1022, 2001, https://doi.org/10.4271/2001-01-1022.Also In
References
- Aluminum Standards and data 11th 1993 The Aluminum Association, Inc.