This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Environment-Friendly Fluxless Soldering Process for High Sealing Ability on Pressure Sensors
Technical Paper
2001-01-0341
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Event:
SAE 2001 World Congress
Language:
English
Abstract
In a conventional soldering process, solvents, such as chlorofluorocarbons (CFCs), have been necessary to remove the flux-residue after soldering.
A new CFC-free fluxless soldering process has been developed to obtain high sealing ability even in a small soldering area. This new process utilizes a reducing atmosphere with an appropriate load and assembly orientation to solder the parts. Under this fluxless condition, it is found that appropriate loading and good solder-wettability of the upper part increase the wettability of the lower part.
Recommended Content
Technical Paper | Pressure Diagnostics of Closed System in a Direct Injection Spark Ignition Engine |
Aerospace Standard | Groove Design, Metal C-Ring Gasket, Face Type Internal Pressure, Metric |
Ground Vehicle Standard | Test Procedure to Measure the Fuel Permeability of Materials by the Cup Weight Loss Method |
Authors
Citation
Yoneyama, T., Okada, H., Izuchi, K., and Kojima, F., "Environment-Friendly Fluxless Soldering Process for High Sealing Ability on Pressure Sensors," SAE Technical Paper 2001-01-0341, 2001, https://doi.org/10.4271/2001-01-0341.Also In
References
- Manko H.H. “SOLDERS AND SOLDERING” McGRAW-HILL,Inc. 1964
- Yoneyama T. et al. Mar. 1994 Nov. 1998