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Miniature Embedded Heat Pipes in Low Temperature Co-Fired Ceramic for Electronic Devices Requiring Temperature Stability
Technical Paper
2000-01-3621
ISSN: 0148-7191, e-ISSN: 2688-3627
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Sector:
Event:
Power Systems Conference
Language:
English
Abstract
A miniature heat pipe constructed from a multi-layered, co-fired ceramic process utilizing brazed-on evaporator and condenser slugs is investigated. The substrate-embedded heat pipe is shown to effectively dissipate the heat generated by a power MOSFET, used as the heat source, while maintaining a nearly constant junction temperature over a power load range from 6 to 10 watts. Independent modeling of the evaporation, vapor flow, condensation, and capillary flow are used to guide the heat pipe development. Predicted operation and experimental operation of the heat pipe are compared.
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Citation
Snyder, S., Newton, C., and Lange, M., "Miniature Embedded Heat Pipes in Low Temperature Co-Fired Ceramic for Electronic Devices Requiring Temperature Stability," SAE Technical Paper 2000-01-3621, 2000, https://doi.org/10.4271/2000-01-3621.Also In
References
- Cao, Y. Faghri, A. Mahefkey, E.T. “Micro/Miniature Heat Pipes and Operating Limitations” 236 Heat Pipes and Capillary Pumped Loops ASME 1993
- Zampino, M. Jones, W.K. “Substrate Embedded Heat Pipes Compatible with Cofire Processing” Proc. Int. Sym. Of Microelectronics IMAPS Philadelphia 1997
- Faghri, A. Heat Pipe Science and Technology Taylor & Francis 1995