This content is not included in your SAE MOBILUS subscription, or you are not logged in.

Simulating the Die Gap Effect on Springback Behavior in Stamping Processes

Technical Paper
2000-01-1111
ISSN: 0148-7191, e-ISSN: 2688-3627
Published March 06, 2000 by SAE International in United States
Annotation ability available
 
Sector:
Language: English