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A Unified Approach to Solder Joint Life Prediction
Technical Paper
2000-01-0454
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Event:
SAE 2000 World Congress
Language:
English
Abstract
A unified approach has been developed and applied to solder joint life prediction in this paper, which indicates a breakthrough for solder joint reliability simulation. It includes the material characterization of solder alloys, the testing of solder joint specimens, a unified viscoplastic constitutive framework with damage evolution, numerical algorithm development and implementation, and experimental validation. The emphasis of this report focuses on the algorithm development and experimental verification of proposed viscoplasticity with damage evolution.
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Authors
Citation
Qian, Z., Shi, L., and Liu, S., "A Unified Approach to Solder Joint Life Prediction," SAE Technical Paper 2000-01-0454, 2000, https://doi.org/10.4271/2000-01-0454.Also In
SAE 2000 Transactions Journal of Passenger Cars - Electronic and Electrical Systems
Number: V109-7; Published: 2001-09-15
Number: V109-7; Published: 2001-09-15
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