This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Thin Copper-Water Heat Pipe Plate for Electronic Cooling
Technical Paper
1999-01-2529
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Language:
English
Abstract
This paper presents experimental results obtained for innovative thin (2 mm) copper-water and copper-acetone heat pipe (HP) plates recently developed at Thermacore. The heat pipe plates are about 120 mm wide and 250 mm long and are developed mainly for electronics cooling applications. There are multiple interconnected fluid channels in the plate, partially filled with liquid. These channels act as miniature heat pipes effectively spreading thermal energy from a heat source, attached to the plate, to the plate surfaces exposed to free-convection air cooling. Inner surfaces of the fluid channels are partially covered with a capillary structure to enhance heat transfer and liquid return during the two-phase fluid circulation with evaporation and condensation inside the channels.
Recommended Content
| Technical Paper | Wick Characterization by Image Analysis |
| Technical Paper | Capillary Limit in a Loop Heat Pipe with Dual Evaporators |
| Technical Paper | Modeling of a Miniature Loop Heat Pipe with a Flat Evaporator |
Authors
Topic
Citation
Khrustalev, D., "Thin Copper-Water Heat Pipe Plate for Electronic Cooling," SAE Technical Paper 1999-01-2529, 1999, https://doi.org/10.4271/1999-01-2529.Also In
References
- Akachi, H. Polashek, F. Pulsating Heat Pipes: a New Challenge in Heat Pipe Technology, 9 th Int. Heat Pipe Conference Albuquerque, New Mexico 1995
- Bowman, W. Storey, J. Svenson, K. Analytical Comparison of Standard Fins and Heat-Pipe Fins, 37 th AIAA Aerospace Sciences Meeting and Exhibit Reno, NV 1999
- Khrustalev, D. Faghri, A. Thermal Analysis of a Micro Heat Pipe, ASME Journal of Heat Transfer 116 1 1994