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Thin Copper-Water Heat Pipe Plate for Electronic Cooling
ISSN: 0148-7191, e-ISSN: 2688-3627
Published August 02, 1999 by SAE International in United States
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This paper presents experimental results obtained for innovative thin (2 mm) copper-water and copper-acetone heat pipe (HP) plates recently developed at Thermacore. The heat pipe plates are about 120 mm wide and 250 mm long and are developed mainly for electronics cooling applications. There are multiple interconnected fluid channels in the plate, partially filled with liquid. These channels act as miniature heat pipes effectively spreading thermal energy from a heat source, attached to the plate, to the plate surfaces exposed to free-convection air cooling. Inner surfaces of the fluid channels are partially covered with a capillary structure to enhance heat transfer and liquid return during the two-phase fluid circulation with evaporation and condensation inside the channels.
|Technical Paper||Wick Characterization by Image Analysis|
|Technical Paper||Capillary Limit in a Loop Heat Pipe with Dual Evaporators|
|Technical Paper||Modeling of a Miniature Loop Heat Pipe with a Flat Evaporator|
CitationKhrustalev, D., "Thin Copper-Water Heat Pipe Plate for Electronic Cooling," SAE Technical Paper 1999-01-2529, 1999, https://doi.org/10.4271/1999-01-2529.
- Akachi, H., and Polashek, F., “Pulsating Heat Pipes: a New Challenge in Heat Pipe Technology,” 9th Int. Heat Pipe Conference, Albuquerque, New Mexico, 1995.
- Bowman, W., Storey, J., and Svenson, K., “Analytical Comparison of Standard Fins and Heat-Pipe Fins,” 37th AIAA Aerospace Sciences Meeting and Exhibit, Reno, NV, 1999 AIAA-99-0475.
- Khrustalev, D., and Faghri, A., “Thermal Analysis of a Micro Heat Pipe,” ASME Journal of Heat Transfer, Vol. 116, No. 1, 1994.