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Automating Thermal Analysis with Thermal Desktop™
ISSN: 0148-7191, e-ISSN: 2688-3627
Published July 12, 1999 by SAE International in United States
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Thermal analysis is typically executed with multiple tools in a series of separate steps for performing radiation analysis, generating conduction and capacitance data, and for solving temperatures. This multitude of programs often leads to many user files that become unmanageable with their multitude, and the user often looses track as to which files go with which cases. In addition to combining the output from multiple programs, current processes often involve the user inputting various hand calculations into the math model to account for MLI/Insulation and contact conductance between entities. These calculations are not only tedious to make, but users often forget to update them when the geometry is changed.
Several new features of Thermal Desktop are designed to automate some of the tedious tasks that thermal engineers now practice. To start with, Thermal Desktop is a single program that does radiation analysis, generates conduction/capacitance data and automates the building of a SINDA/FLUINT model to solve for temperatures. Some of these new features of Thermal Desktop are Radiation Analysis Groups, Property Aliases, MLI/Insulation Objects, Contact Conductance Objects, Model Browser, and the Case Set Manager.
This paper describes the application and benefits of Thermal Desktop along with other unique features used to automate the thermal analysis process.
CitationWelch, M. and Panczak, T., "Automating Thermal Analysis with Thermal Desktop™," SAE Technical Paper 1999-01-2156, 1999, https://doi.org/10.4271/1999-01-2156.
- Lockheed Engineer and Management Services Company “Thermal Radiation Analysis System Users Manual,” JSC 22964, Contract NAS 917900 October 1991
- Panczak, T. Welch, M.J. “Thermal Synthesizer System: An Integrated Approach to Spacecraft Thermal Analysis,” SAE paper 911582 , 22nd ICES Conference July 1992