This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Verification of a Transient Loop Heat Pipe Model
Technical Paper
1999-01-2010
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Language:
English
Abstract
Loop Heat Pipes (LHPs) have been base-lined for thermal management in the next generation of large communication satellites due to their ability to effectively transport energy using two-phase heat transfer. To incorporate LHPs in thermal design, a subroutine was developed to work with a nodal thermal analyzer for transient predictions of LHP operating temperatures. The thermal analyzer (e.g., SINDA or IDEAS/TMG) is used to advance the thermal solution in time, while the subroutine provides the time-varying fluid boundary conditions and adjusts thermal couplings by solving the conservation equations of mass, momentum and energy.
The subroutine was exercised in conjunction with a nodal thermal analyzer to predict the fluid temperatures in a loop heat pipe during transient changes in power and sink temperature. A laboratory test was performed with an ammonia LHP to collect data for verifying the model. Presented in this paper is a description of the model and the test data used to examine the model’s prediction capability.
Recommended Content
Authors
Citation
Wrenn, K., Krein, S., Hoang, T., and Allen, R., "Verification of a Transient Loop Heat Pipe Model," SAE Technical Paper 1999-01-2010, 1999, https://doi.org/10.4271/1999-01-2010.Also In
References
- Nikitkin, M. Cullimore, B. 1998 CPL and LHP Technologies: What are the Differences, What are the Similarities? SAE Paper 981587 , 28th International Conference on Environmental Systems Danvers, MA July 13-16
- Lashley, C. Krein, S. Barcomb, P. 1998 “Deployable Radiators - A Multi-Discipline Approach” SAE Paper 981691 , 28th International Conference on Environmental Systems Danvers, MA July 13-16