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« Ultra Flat Micro Heat Pipes » ® Generation for Space Industry
Technical Paper
1999-01-1976
ISSN: 0148-7191, e-ISSN: 2688-3627
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Language:
English
Abstract
This paper presents a breakthrough in the domain of micro heat pipes for electronic cooling.
The proposed technology consists of a novel, sophisticated but industrial approach in cooling technique with flat and ultra-thin microchannel heat pipes.
We present in the introduction the current needs in term of cooling system for electronic applications. The particular case of space based system is discussed and few projections into the future demonstrate the need for a new generation of cooling device.
The fabrication process is explained to present our product and its flexibility of design and capacity. The key features and performances of a prototype based on this new generation heat pipe are presented.
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Authors
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Citation
Barbazan, J., Benoit, J., Bouchard, O., and Duval, J., "« Ultra Flat Micro Heat Pipes » ®Generation for Space Industry," SAE Technical Paper 1999-01-1976, 1999, https://doi.org/10.4271/1999-01-1976.Also In
References
- Bricard, A. Chaudourne, S. Caloducs; Techniques de l’ingénieur B9545
- Richter, R. Gottschlich, J. Thermodynamic aspects of heat pipe operation AIAA - 90 - 1772 1990
- Sacadura, J. F. Transferts thermiques; ed. Lavoisier 1993 Paris
- Thermophysical properties of heat pipe working fluids ESDU Engineering Data, -Heat pipes- April 1990