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Micro-Cooler for Chip-Level Temperature Control
Technical Paper
1999-01-1407
ISSN: 0148-7191, e-ISSN: 2688-3627
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Language:
English
Abstract
The objective of this paper is to design and fabricate a micro-cooler to provide integral cooling to electronics or Microelectromechanical Systems (MEMS) type components utilizing current MEMS technologies. A three-port capillary pumped loop (CPL) was analyzed and fabricated from silicon and quartz for this purpose. An analytical study of the device is presented in support of this design. This proves the feasibility of such a device, and thus the rationale for continuing its development.
Citation
Kirshberg, J. and Yerkes, K., "Micro-Cooler for Chip-Level Temperature Control," SAE Technical Paper 1999-01-1407, 1999, https://doi.org/10.4271/1999-01-1407.Also In
References
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- Dickey, J.T. Peterson G.P. 1994 Experimental and Analytical Investigation of a Capillary Pumped Loop Journal of Thermophysics and Heat Transfer 8 3 602 607
- Faghri, A. 1995 Heat Pipe Science and Technology Taylor & Francis Washinton D.C.
- Peterson, G.P. Duncan, A.B. Weichold, M.H. 1993 Experimental Investigation of Micro Heat Pipes Fabricated in Silicon Wafers Journal of Heat Transfer 115 751 756