This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Alumina Substrate Developed for Flip-Chip Mount ECU
Technical Paper
1999-01-1100
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Language:
English
Abstract
Alumina substrates have been developed for a flip-chip mount ECU ( Electronic Control Unit ). On this substrate, large sized IC chips as a flip-chip and other electronic components have been mounted. Cu thick film circuit has also been mounted on the other surface. This circuit consists of printed resistors by connecting tungsten metallized layer and Cu thick film through Cu plating. In order to mount the large sized flip-chip IC, the substrate needs strictly precise dimensions. The tolerance of the dimensions are within ± 0.1 % and the warp of the flip-chip area is less than 10 μm per 10 mm.
Authors
- Shinya Terao - R&D Center, Kagoshima, Kyocera Corporation
- Shoichi Nakagawa - R&D Center, Kagoshima, Kyocera Corporation
- Masaki Kaji - R&D Center, Kagoshima, Kyocera Corporation
- Takashi Yamasaki - Semiconductor Parts Division, Kokubu Plant, Kyocera Corporation
- Taku Matsudera - Semiconductor Parts Division, Kokubu Plant, Kyocera Corporation
- Yoshiaki Shimojo - Semiconductor Parts Division, Kokubu Plant, Kyocera Corporation
Topic
Citation
Terao, S., Nakagawa, S., Kaji, M., Yamasaki, T. et al., "Alumina Substrate Developed for Flip-Chip Mount ECU," SAE Technical Paper 1999-01-1100, 1999, https://doi.org/10.4271/1999-01-1100.Also In
References
- Sarma, D. H. R. Stankavich, A. J. Needes, C. R. S. “Ceramic Circuit Technologies for Automotive Electronics Applications,” Automotive Engineering 105 9 9 14 1997
- Nagasaka, T. Ota, S. Asai, Y. Nakano, T. “Ceramic Substrate and Bare Chip Mount Technology that is Required for the Realization of Hybrid ECU,” Autumn Conference of Society of Automotive Engineers of Japan October 21 1998