This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
New Design Concept of Alumina Ceramic Substrate for Future ECU
Technical Paper
1999-01-0864
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Language:
English
Abstract
A new alumina ceramic substrate has been developed for an Electronic Control Unit (ECU). This substrate has a thick conductor circuit made of molybdenum for a power line, accepting high electric current up to 50 Amperes (standard design). The design concept can integrate control and power circuits in one substrate, directly mountable on engines or power train system without any forced cooling system. Cross-sectional shape of the conductor is designed to minimize thermal stress and reduce cracking in the substrate, caused by a thermal expansion mismatch between alumina and molybdenum. Optimization of the design is performed by FEM analyses and X-ray diffraction measurement. We confirmed that the substrate can work after 10,000 cycles of temperature cycle test, and 600,000 cycles of electric cycle test.
Authors
Topic
Citation
Nakagawa, S., Terao, S., Sasaki, Y., and Odonari, K., "New Design Concept of Alumina Ceramic Substrate for Future ECU," SAE Technical Paper 1999-01-0864, 1999, https://doi.org/10.4271/1999-01-0864.Also In
Electronic Engine Controls 1999: Neural Networks, Diagnostic and Electronic Hardware, and Controls
Number: SP-1419; Published: 1999-03-01
Number: SP-1419; Published: 1999-03-01
References
- Fukuyo R. Azuma M. Fujikawa T. Sugimoto M. Kushida T. Ohnishi T. “Automotive Semiconductor Devices in Future” Journal of JSAE 51 3 1997 88 93
- Nagasaka T. Ohta S. Asai Y. Nakano T. “Ceramic Substrate and Bare Chip Mount Technology that is Required for the Realization of Hybrid ECU” Fall Meeting of JSAE 1998
- Sarma D. H. R. Stankavich A. J. Needes C. R. S. “Ceramic Circuit Technologies for Automotive Electronics Applications” Automotive Engineering 105 9 1997 9 14
- Hettich G. Wiedemann W. Genzel M. “A New Integrated Controller Concept for CVT” Proc. CVT 1996 Yokohama 1996 77 81