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Integrated Mold Technology for Semiconductor Device
Technical Paper
1999-01-0161
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
Recently, automotive semiconductor devices need miniaturization. One of the most important technologies is the package which encapsulates devices. In addition, the outer shape of the package is needed to change according to the mounted space. Conventional devices are mounted in the case, and encapsulated with potting resin. However this package structure is difficult to miniaturize because the case size limit. This report describes the development of the packaging technology for miniature and particular outer shape. The devices are set in the cavity and molded to one package. The three-dimension flow simulation is applied to analyze the flow in the cavity. The results of simulation correspond with experimental results. The cavity structure and the mold resin can be optimized by the simulation.
Citation
Shintai, A. and Takenaka, O., "Integrated Mold Technology for Semiconductor Device," SAE Technical Paper 1999-01-0161, 1999, https://doi.org/10.4271/1999-01-0161.Also In
References
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- Takahiro Naito et al. “Thin and Weak Images Destroyed in1 mm Thick LSI Packages” Nikkei Micro Devices 1988
- Atsushi Tanaka et al. “Methods for Reducing Voids by Using Inner Flow Simulations for Encapsulation in Metal Mold” Nitto Technical Report 33 1 1995
- Inoue Matsuoka TOYOTA CENTRAL R&D LABS.,INC. Japan Rayology Society Journal 21 175 1993