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A Novel Cloud-Based Additive Manufacturing Technique for Semiconductor Chip Casings
- Shreya Viswanath - Vellore Institute of Technology: VIT University, School of Mechanical Engineering, India ,
- S. Siddharth - Vellore Institute of Technology: VIT University, School of Mechanical Engineering, India ,
- Jeyanthi Subramanian - Vellore Institute of Technology: VIT University, School of Mechanical Engineering, India
ISSN: 1946-3979, e-ISSN: 1946-3987
Published August 02, 2022 by SAE International in United States
Citation: Viswanath, S., Siddharth, S., and Subramanian, J., "A Novel Cloud-Based Additive Manufacturing Technique for Semiconductor Chip Casings," SAE Int. J. Mater. Manf. 15(4):395-406, 2022, https://doi.org/10.4271/05-15-04-0025.
The demand for contactless, rapid manufacturing has increased over the years, especially during the COVID-19 pandemic. Additive manufacturing (AM), a type of rapid manufacturing, is a computer-based system that precisely manufactures products. It proves to be a faster, cheaper, and more efficient production system when integrated with cloud-based manufacturing (CBM). Similarly, the need for semiconductors has grown exponentially over the last five years. Several companies could not keep up with the increasing demand for many reasons. One of the main reasons is the lack of a workforce due to the COVID-19 protocols. This article proposes a novel technique to manufacture semiconductor chips in a fast-paced manner. An algorithm is integrated with cloud, machine vision, sensors, and email access to monitor with live feedback and correct the manufacturing in case of an anomaly. Several real-time data such as performance graphs, time left, and other current information were sent back to the user on demand. An experiment was set up to optimize deposition parameters. The experiment was successfully executed and stated the advantage of cloud-based AM.