Improved Ultrasonic Imaging of Microscopic Devices

Advances in time gating of ultrasonic signals in scanning acoustic microscopes have been proposed to enable detailed nondestructive examination of bonds and other interfaces deep within the interiors of such micromachined objects as high-density integrated electronic circuits and microelectromechanical systems. The capability to perform such examinations could contribute significantly to ensuring ruggedness and long operational lifetimes for electronic circuits, sensors, and actuators that must withstand harsh environments.