Binding Causes of Printed Wiring Assemblies With Card-Loks

TBMG-14219

08/01/2012

Abstract
Content

A document discusses a study that presents the first documented extraction loads, both nominal and worstcase, and presents the first comprehensive evaluation of extraction techniques, methodologies, and tool requirements relating to extracting printed wiring assemblies (PWAs) with Card-Loks during EVA (extra vehicular activity). This task was performed for the first time during HST (Hubble Space Telescope) Servicing Mission 4.

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Citation
"Binding Causes of Printed Wiring Assemblies With Card-Loks," Mobility Engineering, August 1, 2012.
Additional Details
Publisher
Published
Aug 1, 2012
Product Code
TBMG-14219
Content Type
Magazine Article
Language
English