Binding Causes of Printed Wiring Assemblies With Card-Loks
TBMG-14219
08/01/2012
- Content
A document discusses a study that presents the first documented extraction loads, both nominal and worstcase, and presents the first comprehensive evaluation of extraction techniques, methodologies, and tool requirements relating to extracting printed wiring assemblies (PWAs) with Card-Loks during EVA (extra vehicular activity). This task was performed for the first time during HST (Hubble Space Telescope) Servicing Mission 4.
- Citation
- "Binding Causes of Printed Wiring Assemblies With Card-Loks," Mobility Engineering, August 1, 2012.