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Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems
- Aerospace Standard
- GEIAHB0005_3
- Issued
Downloadable datasets available
Annotation ability available
Sector:
Issuing Committee:
Language:
English
Scope
This document provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task.
This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “Rework/Repair” is used as applicable.
NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.
Recommended Content
Topic
Data Sets - Support Documents
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Table 1 | Assembly and Piece Part Marking Methods | |
TABLE A1 | Piece-part Terminal and BGA Ball Metallization Solder Process Compatibility Risk (Ref: GEIA-HB-0005-2 “Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder”) | |
TABLE A1 | Piece-part Terminal and BGA Ball Metallization Solder Process Compatibility Risk (Ref: GEIA-HB-0005-2 “Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder”) | |
TABLE B1 | Tin Whisker Information (Ref: GEIA-HB-0005-2 “Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder”) | |
TABLE B2 | Piece Part Termination Tin Whisker Risk (Ref: GEIA-HB-0005-2 “Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder”) | |
TABLE B2 | Piece Part Termination Tin Whisker Risk (Ref: GEIA-HB-0005-2 “Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder”) | |
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Issuing Committee
G-24 Pb-free Risk Management Committee for ADHP
Pb-free Risk Management Committee for ADHP Committee develops standards and specifications for Pb-free electronics risk management for the aerospace, defense and high performance electronics industries. The committee also provides input to government and other industry standards related to Pb-free electronics risk management. It does not develop or revise workmanship and manufacturing standards.
Reference
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