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Adhesiveless Flexible Laminate in Automotive Under-the-Hood Electronics
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English
Abstract
Base laminate requirements for flexible circuits in under-the-hood applications are becoming more stringent. This paper examines those requirements as well as supporting test data of an adhesiveless laminate currently used in an under-the-hood application. In addition, a comparison between rigid and flexible laminate based circuits as well as adhesive based and adhesiveless laminates is discussed.