This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Advanced Thermal Modeling of Space Flight Electronics Equipment
Annotation ability available
Sector:
Language:
English
Abstract
Producing thermal models of Space Flight Electronic Equipments using Finite Difference Analysis Tools is currently a standard approach in the Industry. This procedure can, nevertheless, turn out to be very tedious and time consuming specially when temperature predictions are to be taken all the way to the electronic component level.
Combining State of the Art Finite Difference and Finite Element Analysis Tools, in an integrated procedure, can expedite modelling considerably and allow worst case accurate temperature predictions at the component level for all components in the equipment.
This paper shows how this last procedure has been applied to the ESA Polar Platform GOMOS MDE Equipment and presents the results obtained.
Authors
Citation
R'guez Corredera, M., Lata, J., and Sánchez, L., "Advanced Thermal Modeling of Space Flight Electronics Equipment," SAE Technical Paper 961503, 1996, https://doi.org/10.4271/961503.Also In
References
- Arpaci, V.S. “ Conduction Heat Transfer ” Addison-Wesly California 1966
- Siegel, R. Howell, J.R. “ Thermal Radiation Heat Transfer ” McGraw-Hill New York 1972
- Gilmore D.G. “ Satellite Thermal Control Handbook ” The Aerospace Corporation California 1994
- Rodríguez-Corredera, M. “Finite-Difference Analysis Simplifies Heat Transfer Problems” Machine Design Dec. 1994
- Pacific Numerix Corporation “Thermal Analysis PCB Explorer Technical Manual” California 1992
- Martin Marietta Astronautics Group “SINDA FLUINT, Version 2.6 USER'SMANUAL” Denver, Colorado Sept. 1993
- PDA Engineering PATRAN Division; P/THERMAL USER MANUAL Release 2.6 Costa Mesa California March 1993