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New Accelerometer Based on Innovative Packaging and Circuit Design
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English
Abstract
A signal-conditioned accelerometer is described which offers many advantages to the user. The sensor element, manufactured using silicon micromachining, has proven reliability. The signal conditioning does not require external components and thick or thin film technology but is done entirely within a monolithic IC. The sensor and signal conditioning chips are hermetically packaged together in a ceramic leadless chip carrier. The output parameters are trimmed electrically after packaging is completed. The chip carrier can be mounted in several orientations to allow measurement of acceleration either perpendicular to or in plane with the mounting surface.
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Citation
de Bruin, D. and Dunbar, M., "New Accelerometer Based on Innovative Packaging and Circuit Design," SAE Technical Paper 951018, 1995, https://doi.org/10.4271/951018.Also In
References
- Self-testable Accelerometer Systems Allen Henry V. Terry Stephen C. de Bruin Diederik W. Proceedings of IEEE Micro Electro Mechanical Systems IEEE catalog no 89THO249-3 February 1989 113 115
- Accelerometer Systems with Built-in Testing Allen Henry V. Terry Stephen C. de Bruin Diederik W. Abstracts of Transducers '89; The 5th International Conference on Solid-State Sensors and Actuators June 1989 148 149