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Ultra-Thin Multilayer Circuits
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English
Abstract
High density electronic packaging applications will benefit by utilizing this very thin multilayer interconnect construction. Specific advantages include higher packaging density, thinner composite profiles, and flexibility for installation. Especially useful for automotive multiplexing applications is the ability to readily combine high density signal carrying capability with high current carrying capacity all in the same compact package. This paper describes an approach to building ultra-thin multilayer circuits in a repeatable high volume production process. Properties evaluated include dielectric strength between layers, current carrying capacity, and ability to withstand tight folds in flex-to-install applications. Also included is data on electrical performance after high temperature and humidity exposure, and a discussion of minimum pad and via size limitations. The methods described in this paper provide meaningful improvements in achieving higher density interconnect packaging.
Authors
Citation
Saari, M., Anderson, D., and Myers, C., "Ultra-Thin Multilayer Circuits," SAE Technical Paper 940370, 1994, https://doi.org/10.4271/940370.Also In
References
- Kimura T. et al “Commercial Production Technology for Very Thin Multilayer Boards of 5 Lines/Pads” Proceedings, Printed Circuit World Convention VI San Francisco, CA 1993
- Sweitzer Brent “Multilayer Dynamic Flex” Sheldahl, Inc. July 1993