Computer Modelling of Phenolic Postcure

870536

02/01/1987

Event
SAE International Congress and Exposition
Authors Abstract
Content
Parts made from phenolic molding materials must be postcured to promote the thorough crosslinking required for end usage at temperatures above about 175°C. Since the time and energy used in postcuring can represent about ten percent of part cost, efficient postcuring offers significant potential savings.
Based on a kinetic description of the phenolic crosslinking reaction, we have developed a computer model to predict the development of the glass transition during postcure. This model provides a convenient CAD tool for minimizing postcuring costs.
Meta TagsDetails
DOI
https://doi.org/10.4271/870536
Pages
8
Citation
Arimond, J., Fitts, B., and Landi, V., "Computer Modelling of Phenolic Postcure," SAE Technical Paper 870536, 1987, https://doi.org/10.4271/870536.
Additional Details
Publisher
Published
Feb 1, 1987
Product Code
870536
Content Type
Technical Paper
Language
English