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The Digital Image Correlation Technique Applied to Hole Drilling Residual Stress Measurement
Technical Paper
2014-01-0825
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
The residual stresses found in components are mainly due to thermal, mechanical and metallurgical changes of material. The manufacturing processes such as fabrication, assembly, welding, rolling, heat treatment, shot peening etc. generate residual stresses in material. The influence of residual stress can be beneficial or detrimental depending on nature and distribution of the residual stress in material. In general, the compressive residual stress can increase the fatigue life of material because it provides greater resistance for crack initiation and propagation.
A significant number of improvements for residual stress measurement techniques have occurred in last few decades. The most popular technique of residual stress measurement is based on the principle of strain gage rosette and hole drilling (ASTM E837-01, destructive). Although this technique is effective for some applications, strain gages provide the localized or averaged data and cannot capture the peak or high resolution data when this technique is applied on high strain gradient areas. The measured strains are also highly influenced by the position of strain gages around the drilled hole. The improved measurement technique of 3D-Digital Speckle Pattern Interferometry (DSPI) with hole drilling can capture the full-field, high resolution and high accuracy in-plan and out-of-plan deformation data. However, DSPI is easily affected by environmental noises and it cannot measure in-plane and out-of-plane deformation simultaneously.
The needs of Digital Image Correlation (DIC) techniques from industry have been increasing, especially in micro- and nano-scale mechanical testing applications mainly due to its relative easy implementation and utilization. Although DIC has a lower sensitivity than DSPI, it is more robust on spot measurements. Full field contour, displacement and strain data of specimens in any shape can be easily evaluated by DIC. This paper presents a new comprehensive residual stress measurement technique using 3D-DIC and hole drilling mechanism. In this, the residual stress measurement is performed in a full-field and no contact approach.
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Citation
Chen, Y., Chen, X., Xu, N., and Yang, L., "The Digital Image Correlation Technique Applied to Hole Drilling Residual Stress Measurement," SAE Technical Paper 2014-01-0825, 2014, https://doi.org/10.4271/2014-01-0825.Also In
References
- Samala P. Hole Drilling Residual Stress Measurement Using 3D-Digital Speckle Pattern Interferometry PhD Dissertation Oakland University 2007
- Chen Xu , Xu Nan , Yang Lianxiang and Xiang Dan High Temperature Displacement and Strain Measurement Using a Monochromatic Light Illuminated Stereo Digital Image Correlation System 2012 Meas. Sci. Technol. 23 10.1088/0957-0233/23/12/125603
- ASTM E837-01 Standard Method for Determining Residual Stresses by the Hole Drilling Strain Gage Method American Society of Testing and Materials Philadelphia, PA 2001
- Niku Lari A. , Lu J. and Flavenot J.F. Measurement of Residual Stress Distribution by the Incremental Hole Drilling Method Experimental Mechanics 25 6 1985 175 185
- Kabiri , M. , Non Uniform Residual Stress Measurement by Hole Drilling Method Experimental Mechanics 24 4 328 336 1984
- Timoshenko S. P. and Goodier J. N. Theory of Elasticity McGraw-Hill New York 1970
- Schreier , H. , Introduction to Three-Dimensional Digital Image Correlation SEM Presentation 2008
- Chen Fanxiu , Chen Xu , Xie Xin , Feng Xiu , Yang Lianxiang Full-Field 3D Measurement Using Multi-Camera Digital Image Correlation System Optics and Lasers in Engineering 51 2013 1044 1052
- McNeill , S. , Image Correlation Basics SEM Presentation 2008
- Chen , X. , Xie , X. , Sun , J. , and Yang , L. , Full Field Strain Measurement of Punch-Stretch Tests Using Digital Image Correlation SAE Int. J. Mater. Manf. 5 2 345 351 2012 10.4271/2012-01-0183
- Alberto , M. , Measurement of Residual Stresses Using the Holographic Hole Drilling Technique PhD Dissertation Stanford University 1994
- Kelsey R.A. Measuring Non-Uniform Residual Stresses by the Hole Drilling Method Proceedings of SES 14 1 181 194 1956
- Bathgate , R.G. Measurement of non-uniform Biaxial Residual stresses by the Hole Drilling Method Strain 4 2 20 29 1968