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Advances in Polyamide 4T for Lead Free Solder Surface Mount Technology (SMT) Applications
Technical Paper
2013-01-1776
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
Surface Mount Technology (SMT) is a high-productivity and
cost-effective circuit board assembly method used extensively in
the consumer electronics industry. Regulations requiring lead-free
solder have pushed the peak processing temperatures of SMT to as
high as 270°C. This has resulted in the need for higher temperature
performance from contact and circuit insulation. Considering the
rise in infotainment content on vehicles, many onboard devices
already employ the lead-free SMT process. The use of lead-free SMT
processes now extends to the data and control circuit devices of
safety, powertrain and other vehicle electronics.
Polyamide 4T is a proven performer in lead-free solder SMT
applications, namely connectors in the consumer and industrial
electronics industries. The use of polyamide 4T naturally
translates to traditional and emerging automotive electronics
applications.
Using polyamide 4T in lead-free SMT processes allows a design
engineer to realize additional benefits of stable electrical
properties, low warp, good dimensional stability, and the ability
to design in environments with USCar Class 4 and higher continuous
operating temperatures.
With higher thermal, chemical and mechanical demands being
placed on components in the engine compartment there will be an
increasing demand for higher performance resins in electronics
applications.
Performance data will be given showing why polyamide 4T is the
low risk choice compared to other high heat resins for automotive
electronic SMT applications.
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Authors
Citation
Costantino, G., "Advances in Polyamide 4T for Lead Free Solder Surface Mount Technology (SMT) Applications," SAE Technical Paper 2013-01-1776, 2013, https://doi.org/10.4271/2013-01-1776.Also In
References
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- [1] IPC/JEDEC J-STD-020C