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Assessment of High-Temperature Encapsulants for Planar Packages
Technical Paper
2010-01-1729
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Event:
Power Systems Conference
Language:
English
Abstract
Seven encapsulants with operating temperatures up to 250°C were surveyed for use in planar packages for wide-bandgap dice. Two of the encapsulants failed processability test because they were not able to flow, and another two failed because they induced voids or cracks after curing. The dielectric results of the remaining three encapsulants showed that both dielectric strength and permittivity decreased almost 40% when the temperature was increased up to 250°C. As the three encapsulants were used to encapsulate a power module, it was proven that all of them could protect the package from early breakdown caused by the poor dielectric strength of air.
Authors
Citation
Yao, Y., Seshadri, J., Lu, G., Ngo, K. et al., "Assessment of High-Temperature Encapsulants for Planar Packages," SAE Technical Paper 2010-01-1729, 2010, https://doi.org/10.4271/2010-01-1729.Also In
References
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