Direct Bonding of a Multi-Layer Circuit Substrate to a Heatsink
2007-01-4220
10/30/2007
- Event
- Content
- Phoenix International, the electronics manufacturing group of John Deere, has developed a product and manufacturing process to address many of the shortcomings of conventional heatsinking technologies. In this process, a thin circuit board is bonded directly to a flat surface heatsink such as a finned extrusion or liquid-cooled plate. The major benefits of the proposed solution are the simplification of the manufacturing process and substantially improved conduction of heat away from high-power circuitry.
- Pages
- 7
- Citation
- Godbold, C., and Tolstedt, J., "Direct Bonding of a Multi-Layer Circuit Substrate to a Heatsink," SAE Technical Paper 2007-01-4220, 2007, https://doi.org/10.4271/2007-01-4220.