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Realizing Distributed Engine Control Subsystems through Application of High Temperature Intelligent Engine Sensors and Control Electronics
Technical Paper
2000-01-1363
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Event:
SAE 2000 World Congress
Language:
English
Abstract
This paper illustrates a new and cost effective approach to the design and manufacture of intelligent sensors and control electronics that reliably operate up to 300 Degrees Centigrade. A description of this Silicon-on-insulator (SOI) technology for creating both the sensors and integrated circuits is provided. Measured results that demonstrate the inherent reliability of this technology at high temperatures are presented. Representative distributed control architectures and applications such as engine control units; valve position sensors and exhaust gas recirculation sensor electronics are illustrated. A new, SOI-based, 32-bit microprocessor powerful enough to form the “core” of an advanced engine control unit is described.
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Authors
Citation
Wick, D., "Realizing Distributed Engine Control Subsystems through Application of High Temperature Intelligent Engine Sensors and Control Electronics," SAE Technical Paper 2000-01-1363, 2000, https://doi.org/10.4271/2000-01-1363.Also In
References
- SOI Devices For High Temperature Applications Ohme Bruce and others 3 rd International HiTec Conference June 1998
- Needs And Applications of High Temperature LSIs for Automotive Electronic Systems Hattori Masayuki Toyota Motor Corporation July 1999 HiTen Conference
- Future High Temperature Needs Wondrak Wolfgang Dr. Daimler Chrysler December 1998 HiTen Workshop
- Guggenmos Johannes BMW Inc. September 1998
- Some Reliability Aspects Of High Temperature ICs February 1998 Brusius Phillip Honeywell Inc.
- Reliable Electronics for High Temperature Downhole Applications October 1999 Gingerich Ben Brusius Phillip McClean Ian
- May 1998 Philips Semiconductor UZZ9000 Data Sheet
- Reliability of Commercial Plastic Encapsulated Microelectronics at Temperatures From 125 To 300C McCluskey Patrick and others July 1999 HiTen Conference
- Motorola Corporation PowerPC 603e Data Sheet http://www.mot.com/SPS/PowerPC/products/semiconductor/cpu/603.html