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Micromachined Heat Sinks
Technical Paper
1999-01-1408
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network that enhances cooling efficiency and minimizes the pressure drop across the device. Experimental test results are presented. Tests to date indicate that up to 76.5 W/cm2 may be removed by the heat sink based on a 100°C electronic device temperature.
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Authors
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Citation
Bang, C., Pan, T., and Hyman, D., "Micromachined Heat Sinks," SAE Technical Paper 1999-01-1408, 1999, https://doi.org/10.4271/1999-01-1408.Also In
References
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- Weisberg, A. Bau, H. Analysis of Microchannels for Integrated Cooling International Journal of Heat and Mass Transfer 35 10 2465 2474 1992
- Joo, Y. Dieu, K. Kim, C. Fabrication of Monolithic Microchannels for IC Chip Cooling IEEE International Workshop on Micro Electro Mechanical Systems Amsterdam, Holland 362 367 1995
- Stefanescu, S. Mehregany, M. Leland, J. Yerkes, K. Micro Jet Array Heat Sink for Power Electronics IEEE International Workshop on Micro Electro Mechanical Systems Orlando, FI. 165 170 1999