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Flexible Multilayer Designs Provide Cost Effective Packaging Solutions
Technical Paper
1999-01-0162
ISSN: 0148-7191, e-ISSN: 2688-3627
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Language:
English
Abstract
This paper discusses a variety of manufacturing techniques which have been developed to produce cost effective multilayer interconnects while overcoming the harsh environmental conditions imposed by the Automotive Industry. A comparison is made to the transition of Military Rigid-flex technology and materials needed to overcome the aerospace environment.